TSMC Taps GlobalFoundries for US Silicon Interposer Production
TSMC has agreed to a $2 billion deal with GlobalFoundries to produce silicon interposers for its CoWoS advanced packaging in the United States, supporting domestic production of AI and high-performance computing chips.
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| Oct 8, 11:23 AM | tomshardware.com | GlobalFoundries to produce silicon interposers for TSMC's CoWoS in the US |
| Oct 8, 10:22 AM | theregister.com | TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal |